Technological Innovation: STEI ITB Receives Advan Laptop with Motherboard Developed by KEDAI REKA to Increase the Value of TKDN

Bandung, stei.itb.ac.id – On Monday, May 18, 2024, the School of Electrical Engineering and Informatics (STEI) of the Bandung Institute of Technology (ITB) held a handover event for Advan laptops that carry motherboard innovations developed by the KEDAI REKA 2023 Research Team chaired by Dr.Eng Sarwono Sutikno. The event took place in the STEI Meeting Room, 2nd Floor, Labtek VIII, attended by ., Dean STEI.

This innovation marks a step forward in increasing the value of TKDN (Domestic Component Level) laptops without BMP (Corporate Benefit Weight) in Indonesia. Developed through collaboration between STEI ITB and Advan, the motherboard designed by Dr.Eng Sarwono Sutikno with the KEDAI REKA 2023 Research Team successfully increased TKDN laptops without BPM from 25% to 35%.

Advan laptops with this innovative motherboard are expected to contribute to reducing Indonesia's dependence on imported electronic components and strengthening the domestic technology industry.

This handover event is an important momentum in the journey of STEI ITB and Advan in creating technological innovations that have a positive impact on society and industry in Indonesia.