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STEI ITB and Chung-Ang University Sign Scholarship Agreement, Expanding International Opportunities for Students

STEI ITB dan Chung-Ang University Teken Kontrak Beasiswa, Perluas Peluang Mahasiswa di Kancah Internasional

STEI ITB and Chung-Ang University Sign Scholarship Agreement, Expanding International Opportunities for Students

Bandung, stei.itb.ac.id – The School of Electrical Engineering and Informatics (STEI) of the Bandung Institute of Technology together with Chung-Ang University, South Korea, signed a scholarship contract on Thursday (18/6/2026) at the Faculty Lounge of STEI ITB, Labtek VIII, 2nd Floor. This activity is a concrete step in strengthening international cooperation while opening wider opportunities for students to develop academic capacity at the global level.

The event was attended by the Dean of STEI ITB, Prof. Dr. Ir. Tutun Juhana, S.T., M.T., I.P.U., and the Vice Dean for Academic Affairs of STEI ITB, Dr. techn. Muhammad Zuhri Catur Candra, S.T., M.T. From Chung-Ang University, Prof. Wi Jong Hyun was present as a representative of the institution. Also present were a number of representatives of STEI ITB students who are part of the collaborative program.

The signing of this scholarship agreement reflects the commitment of both institutions to strengthening collaboration in education and human resource development. Through this program, students are expected to gain greater access to international academic experiences, a multicultural learning environment, and opportunities to expand their global networks.

Dalam konteks pendidikan tinggi yang semakin terhubung secara global, kerja sama beasiswa menjadi salah satu instrumen penting untuk mendukung mobilitas mahasiswa dan meningkatkan kualitas lulusan. Kehadiran program semacam ini juga diharapkan dapat mendorong pertukaran pengetahuan dan pengalaman yang memberikan manfaat bagi kedua institusi.

In addition to strengthening the relationship between STEI ITB and Chung-Ang University, this activity demonstrates the commitment of both universities to building a sustainable partnership. This growing international collaboration is expected to support the creation of an innovative, inclusive, and globally competitive academic ecosystem.

Through the signing of this scholarship contract, STEI ITB reaffirms its commitment to providing various development opportunities for students and expanding strategic partnerships with leading educational institutions worldwide. The program is expected to open doors for the development of more outstanding talent ready to contribute at the national and international levels.