STEI ITB Receives a Visit from Friendcom to Discuss Student Internship Opportunities

Bandung, stei.itb.ac.id – The School of Electrical Engineering and Informatics of the Bandung Institute of Technology (STEI ITB) received a visit from Friendcom on Monday (4/5) in order to discuss cooperation plans through the signing of an MoU. Memorandum of Agreement (MoA). This meeting focused on developing an internship program for STEI ITB students as part of an effort to strengthen the connection between academia and industry.

The visit, which took place at STEI ITB, was attended by representatives of faculty leadership and a team from Friendcom. During the discussions, both parties explored collaborative schemes that could provide practical experience for students through structured internship programs relevant to current industry needs.

STEI ITB welcomes this collaborative initiative as a strategic step to improve graduates' readiness for the workforce. The internship program is designed to not only provide professional experience but also provide opportunities for students to engage directly in real-world projects in the industry.

Meanwhile, a Friendcom representative expressed their commitment to supporting the development of young talent in the technology sector through collaboration with educational institutions. This collaboration is expected to be the beginning of various follow-up programs that will be mutually beneficial for both parties.

Through this MoA discussion, STEI ITB continues to expand its partnership network with industry to provide an adaptive learning ecosystem that is oriented towards future needs.