STEI ITB Present in Uzbekistan to Sign MoU, Strengthen Academic Cooperation with New Uzbekistan University in ICISCA 2023

Bandung, stei.itb.ac.id – Dr. Techn. Saiful Akbar, ST., M.T., Vice Dean for Academic Affairs STEI ITB as a representative from Prof. Dr. Ing. Ir. Widjaja Martokusumo, has been present at the event International Conference on Information, Systems and Convergence Applications (ICISCA) 2023 which will be held in Uzbekistan on July 3 – July 6, 2023.

In order to strengthen academic and research cooperation between ITB and New Uzbekistan University, Dr. Saiful Akbar from STEI ITB arrived in Tashkent to establish relations between two leading institutions in the fields of engineering and information technology. As a representative of Prof. Dr. Ing. Ir. Widjaja Martokusumo, Dr. Saiful Akbar responsible for signing a memorandum of understanding (MoU) that will take the partnership between the two universities to a new level.

The MoU, signed at the ICISCA 2023 event, covers several initiatives, including student exchanges, joint curriculum development, joint research programs, and other academic activities. This collaboration is expected to provide tangible benefits to students and faculty from both universities, open access to new resources and opportunities, and foster strong international networks between the academic communities in Indonesia and Uzbekistan.

Kehadiran Dr. Saiful Akbar The ICISCA 2023 event left a positive impression on the participants attending this international conference. This step is expected to be the beginning of a productive and fruitful collaboration between the two universities, bringing positive changes to the world of engineering and informatics education and research in both countries.

We hope this collaboration will be a bright starting point for a more collaborative and innovative future in higher education in Indonesia and Uzbekistan.