News
Notifications of acceptance for BATCH 1 have been sent to authors. Congratulation for authors with accepted paper. Please refer to the authors for camera-ready paper guidelines.
The camera-ready paper submission deadline is extended to September 15th, 2025.
While preparing for the camera-ready paper, authors can register for the conference. Details of registration can be read at registration.
The notification of acceptance of BATCH 1 is postponed to August 31st, 2025.
Full paper submission deadline for BATCH 1 has passed. We will send the notification of acceptance on August 12th, 2025.
We are opening BATCH 2 for full paper submission for regular and special sessions until September 10th, 2025.
To accommodate author’s requests, we have extended the deadline to July 30th, 2025.
We have extended the deadline for submission to July 20th, 2025.
There will be four special sessions in ISPACS 2025. Check on: Special Sessions
About
The International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS) is the premier networking forum of leading researchers especially from Asia-Pacific based in the highly active fields of theory, design and implementation of intelligent signal processing and communication systems. ISPACS 2025 will be held in Bandung, Indonesia from 4th to 7th November 2025. The symposium presents every possibility on new technologies based on signal processing and communication.
ISPACS has been held since 2004. Proceeding of previous ISPACS can be found at IEEEXplore.
Important Dates
BATCH 2
- Submission of regular and special session paper deadline: September 10th, 2025
- Notification of acceptance: September 30th, 2025
- Camera-ready paper submission deadline: October 15th, 2025
BATCH 1
- Submission of regular & special session papers deadline: July
10th20th30th, 2025 - Notification of acceptance: August 31st, 2025
- Camera-ready paper submission deadline: September 15th, 2025
SPECIAL SESSIONS
- Special session proposals deadline: May 31st, 2025
- Notification of acceptance for proposals: June 6th, 2025
REGISTRATION
- Open Registration: TBA
- Early Bird Registration Deadline (BATCH 1): TBA
- Registration Deadline: October 28th, 2025
- Conference Date: November 4-7, 2025
Submission of Full Papers Deadline (BATCH 2)
SEPTEMBER 10th, 2025
Notification of Acceptance
(BATCH 2)
SEPTEMBER 30th, 2025
Submission Site
Prospective authors are invited to submit papers reflecting original, unpublished work in the following topics. Papers are at least 4 pages and should not exceed 6 pages including results, figures, and references. Manuscript templates will be made available on the Author Guidelines. Only electronic submissions with PDF files will be accepted via the symposium website.
Authors are expected to present their papers at the symposium upon acceptance and presenting authors are required to register for the symposium. Only papers presented at the symposium will be submitted to IEEE for further review to be submitted to IEEEXplore.
Topics
Communication Systems
- Wireless Communication Systems
- Optical Wireless, Satellite, mmWave Communications
- Full Duplex Wireless, Reconfigurable Intelligent Surfaces
- Joint Radar and Communication Design
- Multiantenna Communication
- Antenna, Radio Propagation and Channel Modelling
- Resource Allocation and Software Defined Networks
- Others
Signal Processing
- Al for Signal Processing and Communication Systems
- Digital Filters and Multirate Signal Processing
- Fast Computations for Signal Processing
- Array and Radar Signal Processing
- Adaptive, Nonlinear and Multidimensional Signal
Processing - Others
Multimedia and Systems
- Speech, Audio, Image, Video Processing and Coding
- Generative Artificial Intelligence
- Multimedia Processing for e-Learning, loT and Al
Applications - Multimedia Technology and Communications
- Deep Learning
- Others
Circuits and Systems
- Circuits and Systems for loT, Al, and Communications
- Analog and Mixed Signal Processing
- Numerical Methods and Circuit Simulation
- Sensors, Devices, and Intelligent Instrumentations
- Machine Learning and Neuromorphic Circuits
- Others
VLSI
- Analog and Digital ICs
- Modelling, Simulation, Synthesis and CAD Tools
- VLSI Architecture for Signal Processing or Al Systems
- Reconfigurable and Adaptive Architectures
- Heterogeneous and Multiprocessor System-on-chip
- Graphic, Video, and Multimedia DSPs
- Others
Human Computer Interaction
- User Experience Design
- Perceptual Interfaces
- Human-Technology Symbiosis
- Artificial Intelligence and loT
- Human-Environment Interactions
- Others
Emerging Technologies in Signal Processing and Communication
Prof. Seishi Takamura
Hosei University, Japan
-TITLE-
ABSTRACT
BIOGRAPHY
Dr. Seishi Takamura is a Research Professor at NTT Corporation and a Professor at Hosei University, Japan. He earned his B.E., M.E., and Ph.D. degrees from the Department of Electronic Engineering, Faculty of Engineering, at the University of Tokyo, in 1991, 1993, and 1996, respectively. His current research interests include efficient video coding and ultra-high-quality video processing.
Dr. Takamura has held numerous key roles in the research and academic community. He served as Associate Editor for the IEEE Transactions on Circuits and Systems for Video Technology (2006–2014), Editor-in-Chief of the Institute of Image Information and Television Engineers (ITE), and as an Executive Committee Member of IEEE Region 10 and Japan Council. He also served as Chair of the Japan National Body and as Japan’s Head of Delegation for ISO/IEC JTC 1/SC 29. From 2005 to 2006, he was a Visiting Scientist at Stanford University, California, USA.
Dr. Takamura has received 78 academic awards, including the ITE Niwa-Takayanagi Awards (Best Paper in 2002, Achievement in 2017), the Information Processing Society of Japan (IPSJ) Nagao Special Researcher Award in 2006, the ITE Fujio Frontier Award in 2014, and the Telecommunications Advancement Foundation (TAF) Telecom System Technology Awards in 2004, 2008, and 2015, all with highest honors. He also received the Institute of Electronics, Information and Communication Engineers (IEICE) 100-Year Memorial Best Paper Award in 2017, the Distinguished Achievement and Contributions Award in 2025, the Kenjiro Takayanagi Achievement Award in 2019, the Industrial Standardization Merit Award from Japan’s Ministry of Economy, Trade and Industry in 2019, and the IPSJ/ITSCJ Standardization Achievement Award in 2022.
Dr. Takamura is an IEEE Fellow, an IEICE Fellow, an IPSJ Fellow, an ITE Fellow, an AIAA Fellow, and an AIIA Fellow. He is also a member of Japan MENSA, the President of IIEEJ (2024–2026), and a Vice President of the Asia-Pacific Signal and Information Processing Association (APSIPA, 2020–2023).
Prof. Akira Hirose
The University of Tokyo, Japan
ADVANCED AI FOR EARTH OBSERVATION IN THE FORTHCOMING MASSIVE DATA ERA
ABSTRACT
The number of Earth observation satellites is rapidly increasing. Their observation data will become dramatically dense in time and space, enriching data of polarimetric, interferometric, and polarimetric0interferometric synthetic aperture radars. This will also drive advances in the use of artificial intelligence (AI) in data collection and initial processing. In this keynote speech, we will take up quaternion reservoir computing, outline its features and effectiveness, and look ahead to future developments in Earth observation in the massive data era.
BIOGRAPHY
Dr. Konrad Young
National Taiwan University of Science and Technology, Taiwan
-TITLE-
ABSTRACT
BIOGRAPHY
Dr. Konrad Young obtained his doctoral degree in Electrical Engineering and Computer Science from the University of California, Berkeley. When in the United States, he served as a researcher at the Lincoln Laboratory of the Massachusetts Institute of Technology (MIT) and as a senior technologist at HP. After leaving the United States, he successively worked at Chartered Semiconductor, Winbond Electronics, and Worldwide Semiconductor. From 1998 to 2005, he served as the R&D Director at TSMC, responsible for developing advanced processes at 0.18-micron, 0.13-micron, and 65-nanometer. In 2005, he went to the United States to oversee TSMC’s research and development program and advanced technology customer collaboration projects. In 2012, he transferred to TSMC’s Basic Engineering Department and the Office of Advanced Technology Management.
In 2001, TSMC began mass production of the 0.13-micron process, laying the foundation for TSMC’s later significant lead over its competitors. Several key figures involved in the development efforts were later hailed as the “Six Knights of TSMC’s R&D,” with Dr. Young being one of them responsible for integrating the overall logic process.
After retiring from TSMC, Dr. Young served as an independent SMIC director and technical advisor to Intel. He is currently a CEO in the College of Industry-Academia Innovation at National Taiwan University of Science and Technology and is deeply passionate about talent development issues.
Circuits and Systems Design for AIoT Applications
Artificial Intelligence of Things (AIoT), is the convergence of Artificial Intelligence (AI) and the Internet of Things (IoT), combining the data-collecting capabilities and connectivity of IoT devices with the analytical and decision-making powers of AI. By embedding lightweight machine-learning intelligence into connected sensors, actuators, and wearable devices, AIoT enables real-time analytics in smart homes and factories, predictive maintenance in energy and transportation, personalized healthcare and eldercare, environmental monitoring for climate-resilient agriculture, and adaptive infrastructure for future smart cities. These diverse use cases share a common technical challenge: stringent constraints on power, latency, reliability, security, and cost that can only be met through innovative circuit and system-level co-design.
This special session invites contributions that advance the state of the art in integrated-circuit (IC) and system architectures tailored to AIoT workloads. Topics include, but are not limited to low-power digital/analog/mixed-signal circuits for on-device learning and inference, reconfigurable and heterogeneous system-on-chip (SoC) combining CPUs, GPUs, FPGAs, and TPU for edge intelligence, hardware-software (HW-SW) co-optimization for rapid IoT prototyping, and case studies demonstrating end-to-end AIoT systems.
Quantum Information Processing and Technology
Quantum information processing offers new opportunities for tasks like image recognition, classification, and complex pattern analysis by leveraging quantum algorithms such as Quantum Machine Learning (QML), Quantum Fourier Transform (QFT), and other emerging quantum techniques. These approaches promise faster and more efficient data processing for applications in signal processing, communications, and AI.
This special session invites contributions on developing and applying diverse quantum algorithms—including variational circuits, quantum search, and optimization methods—for tasks such as image and signal classification, feature extraction, and secure communications, as well as demonstrations of practical quantum-assisted systems.
Open-Source Chip Design
Recent global chip shortages have highlighted the urgent need for more talent in chip design. At the same time, the open-source hardware movement is rapidly advancing the field of integrated circuits (IC) and system-on-chip (SoC) design. This special session brings together researchers to share their latest work and experiences using open-source IC design tools and methodologies. Given the traditionally high cost of commercial IC design tools, open-source alternatives offer a transformative opportunity—especially for universities and academic institutions worldwide.
This session will cover a wide range of topics, including open-source design flows, technical applications, tools, and collaborative frameworks. By showcasing real-world use cases and efforts in breaking the barriers to tapeouts, the session aims to foster dialogue and collaboration across academia, industry, and the open hardware community.
Hyper-Personalized AI for Digital Future
As the digital era accelerates, the demand for more personalized, context-aware, and intelligent systems continues to grow. This special session (SS) explores the development and application of hyper-personalized artificial intelligence (AI) technologies that adapt to individual user preferences, behaviors, and real-time contexts.
By leveraging advanced machine learning algorithms, multimodal data processing, and edge computing, hyper-personalized AI enables more responsive and tailored experiences across domains such as education, healthcare, e-commerce, and smart living. We also present case studies and future directions, emphasizing how hyper-personalized AI can redefine user engagement and shape the digital future.
Submission Guidelines
Manuscript must be prepared in English with a maximum length of four (4) to six (6) printed pages IEEE format (ten-point font) including figures. The symposium maintains the right to refrain from reviewing papers that are longer than 6 pages. For your submission you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats which can be found at: IEEE Manuscript Template.
Technical paper must be submitted electronically via Submission Site.
The format for the manuscript must satisfy the following requirements:
- Manuscript must be in English.
- The manuscript must follow IEEE two-column format with single-spaced, ten-point font in the text. The maximum manuscript length is four (4) to six (6) pages. All figures, tables, references, etc. are included in the page limit.
- Papers must be submitted in Portable Document Format (PDF).
- Papers must be formatted for standard letter-size (8.5″ x 11″) paper.
- Authors must submit their papers electronically via paper submission system.
Camera-Ready Paper Guidelines
Here are 3 steps for authors with accepted paper have to do for camera-ready paper:
Paper Revision
Revise your paper(s) according to the reviewer’s comments. Make sure your paper following the IEEE Xplore manuscript rules.
PDF Check
Validate your final paper using the IEEE PDF eXpress. Please read the PDF eXpress Guidelines..
Upload Final Version
Upload the IEEE PDF eXpress–validated version of your paper to the submission site. The output PDF filename must correspond to your IEEE PDF eXpress ID number.
PDF eXpress Guidelines
Before creating a PDF
Proofread your source document thorougly to confirm that it will require no revision.
Creating PDF eXpress Account
- Login to the IEEE PDF eXpress® site.
- First-time users should do the following:
- Create account
- Enter the following:
- 68724X for the conference ID
- your email address
- a password
- Continue to enter information as prompted.
An online confirmation will be displayed and an email confirmation will be sent verifying your account setup.
- Previous users of PDF eXpress need to follow the above steps but should enter the same password that was used for previous conferences. Verify that your contact informations is valid.
Registration Dates
- Registration open: TBA
- Early-bird registration deadline (BATCH 1): TBA
- Registration deadline: October 28th, 2025.
Registration Fee
International Participant
- IEEE Member: USD 500
- Non IEEE Member: USD 550
- Student IEEE Member: USD 300
- Student Non-IEEE Member: USD 350
Domestic Participant
- IEEE Member: IDR 3.000.000,00
- Non IEEE Member: IDR 3.500.000,00
- Student IEEE Member: IDR 2.000.000,00
- Student Non-IEEE Member: IDR 2.500.000,00
- Non-Author or non-participant: IDR 1.000.000,00
Registration fee is NON REFUNDABLE.
Registration Policy
- At least one author of each accepted paper MUST register at the FULL registration fee and present the paper at the conference in order for the paper to be included in the Conference Proceeding and to be submitted for inclusion into IEEExplore. One author FULL registration will allow to present a maximum of two accepted papers.
- For a non-Author or non-presenter participant, they have to register at the FULL registration fee in order to access all conference sessions, conference proceeding, lunch, and 2 times coffee breaks.
- Accepted papers will not be included in the Conference Proceeding if they do not have an author registered at the FULL registration fee.
- “Member” rates apply to members of IEEE and other IEEE’s sister society.
- Student registration should be proven by valid student ID. Scanned student ID is submitted during online registration and the student ID should be shown during the Conference at the Registration Desk (if you have selected the in-person presentation option).
- Member or Student Member must declare a valid membership status, e.g. a scanned of Member or Student Member card or other evidences, during online registration.
Venue
Swiss-Belresort Dago Heritage, Bandung City, West Java, Indonesia
Getting To Bandung

Greetings, ISPACS Participants!
And welcome to Indonesia to all the international participants. If you come to Indonesia through Soekarno Hatta International Airport, this is our recommended method to reach Bandung
- SOEKARNO HATTA INTERNATIONAL AIRPORT
After your safe landing in Terminal 3 and claiming your baggage, you can find our partner Blue Bird Group just outside the baggage claim area by looking for ISPACS 2025 on the counter’s name.
- BLUE BIRD X ISPACS 2025 TICKET COUNTER
You may show your participant’s number and identification. The clerk will offer two options: a direct route to Bandung City, or connecting route via Whoosh High Speed Rail. Don’t be shy to ask any question regarding the trip.
- ON THE ROAD
If you choose direct route, you will be taken directly to Bandung City. If you choose connecting route, you will be taken to Whoosh Station Jakarta at Halim.
- WHOOSH STATION JAKARTA HALIM
You can buy Whoosh ticket at the station’s ticket counter. Inform the clerk that your destination is the Padalarang Station. Get on your train and enjoy the ride on our country’s first High Speed Rail.
- WHOOSH STATION PADALARANG
Make sure that you get off on Padalarang Station as you have to continue your journey using feeder train that will take you from Padalarang Station to Bandung Station in Bandung City.
- BANDUNG CITY
Welcome to Bandung Kota Kembang where ISPACS 2025 will be held. You can join us on Day 1, November 4th to attend the Welcome Reception. Don’t forget to visit tourist attractions and enjoy your stay here.
Other Information
If you would like to know other transportation method or other inquiries, you can contact us at: ispacs2025@staff.stei.itb.ac.id
Download travel flyer.
ORGANIZING COMMITTEE
General Chair: Trio Adiono, Institut Teknologi Bandung, Indonesia
General Co-Chair: Yeon Ho-Chung, Puk Yong Univeristy Korea
Secretary: Nana Sutisna, Institut Teknologi Bandung, Indonesia,
Ade Irawan, Pertamina University, Indonesia
Nurmeisheila Aghnia, Institut Teknologi Bandung, Indonesia,
Finance Chair: Nur Ahmadi, Institut Teknologi Bandung, Indonesia
Finance Co-Chair: Rian Ferdian, Universitas Andalas, Indonesia
Arieska Nadia, Institut Teknologi Bandung, Indonesia,
Publication Chair: Rahmat Mulyawan, Institut Teknologi Bandung, Indonesia
Publication Co-Chair: Wahyul Amien Syafei, Universitas Diponegoro
Publicity Chair: Akhmadi Surawijaya, Institut Teknologi Bandung
Publicity Co-Chair: Emerson Pascawira Sinulingga, Universitas Sumatera Utara
Publicity Co-Chair: Farkhad Ihsan Hariadi, Institut Teknologi Bandung
Website Arrangement Chair: Waskita Adijarto, Institut Teknologi Bandung
Website Arrangement Co-Chair: Muhammad Iqbal Arsyad, Institut Teknologi Bandung
Local Arrangement
- Elvayandri Muchtar, Institut Teknologi Bandung, Indonesia
- Adi Indrayanto, Institut Teknologi Bandung
- Ahmad Fitriyansah, Institut Teknologi Bandung
- Nopika Dewi Susilowati, Institut Teknologi Bandung, Indonesia
Technical Program Chair: Infall Syafalni, Institut Teknologi Bandung, Indonesia
Technical Program Co-Chair: Agus Bejo, Gadjah Mada University, Indonesia
Technical Program Co-Chair: Dhany Arifianto, Institut Sepuluh November, Surabaya, Indonesia
TPC Members
- Poki Chen
- Ray Guang Cheng
- Chih-Wen Lu
- Nico Suranta
- Rachmad Vidya
- Nicodemus Retdian
- Masayuki Kurosaki
- Roy Simunangkir
- Singo Yoshizawa
- Arif Sasongko
- Irman Idris
- Mervin Tangguar Hutabarat
- Ade Irawan
- Hendra Setiawan
- Husneni Mukhtar
- Rian Ferdian
- Willy Anugrah Cahyadi
IEEE ISPACS ISC/IAC (2025 - )
International Steering Committee
- Takayuki Nakachi (Chair)
- Trio Adiono (Vice Chair)
- Hiroshi Tsutsui
- Chiranut Sa-ngiamsak
- KokSheik Wong
- Shingo Yoshizawa
- Huanqiang Zeng
- Chih-Hsien Hsia
- Pornchai Phukpataranont
- Yeon Ho Chung
- Jing-Ming Guo
- Hao San
- Naoto Sasaoka
- Hiroshi Ochi
- Chin Kuan Ho
- Phooi Yee Lau
- Shou-Sheu Lin
- Sun-Ting Lin
International Advisory Committee
- Tomonori Aoyama
- Shin-ichi Koike
- Byeong Gi Lee
- Lin-shan Lee
- Naohisa Ohta
- Yoshikazu Miyanaga
- Takao Onoye
- Kosin Chamnongthai
- Kaoru Arakawa
- Jen-Shiun Chiang
- Canhui Cai
- Akira Taguchi
- Yoshio Itoh
- Kai-Kuang Ma
- Pichaya Tandayya
- Miin-Jong Hao